Gate electrode structure, MOS field effect transistors and methods of manufacturing the same
US7842977B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2007 |
| Grant date | Nov 30, 2010 |
| Priority date | — |
| Expiry date | Feb 15, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/038
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A gate electrode structure comprises at least one bi-layer, wherein each bi-layer comprises a plating film and a stress amplifier film. The plating film includes a poly-crystalline material. The stress amplifier film determines the crystallization result of the poly-crystalline material, wherein a mechanical stress induced through the plating layer is amplified. Tensile or compressive strain may be induced in a crystalline substrate. Electron or hole mobility may be increased and on-resistance characteristics of a MOS field effect transistor may be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.