Method for manufacturing electronic parts module
US7845074B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2009 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | Jul 10, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49172
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The method for manufacturing an electronic parts module includes an adhesive layer forming process forming an adhesive layer including solder particles on the circuit forming surface in range covering at least the first land part and the second land part; a passive element mounting process positioning a terminal of the passive element on the first land part and sticking the passive element to the base wiring layer through the adhesive layer; an active element mounting process, after the passive element mounting process, positioning a terminal of the active element on the second land part and sticking the active element to the base wiring layer through the adhesive layer; a pressing process solidifying the adhesive layer and melting the solder particles by laminating and thermally pressing a thermosetting sheet onto the circuit forming surface so as to form the resin sealing layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.