Dressing a wafer polishing pad
US7846006B2 · kind B2 · utility
2Cited by
14References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2007 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | Jan 28, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A controller for controlling the dressing apparatus has pre-programmed recipes that are selectable based on the radial profile of a measured polished wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.