Patent · US Active

System and method for dressing a wafer polishing pad

US7846007B2 · kind B2 · utility

1Cited by

14References

22Claims

0Family size

Assignee

MEMC Electronic Materials, Inc. · US

Inventors

Mark Stinson · East Alton, US
Madhavan S. Esayanur · Saint Peters, US
Dennis Buese · O'Fallon, US
Emanuele Corsi · Novara, IT
Ezio Bovio · Novara, IT
Antonio Maria Rinaldi · Novara, IT
Larry Flannery · Warrenton, US

Key dates

Filing date	Jan 9, 2009
Grant date	Dec 7, 2010
Priority date	—
Expiry date	Jan 9, 2029

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B53/017
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning apparatus is mounted adjacent the polishing pad for removing particulate and chemicals from the polishing pad. The system includes a controller for controlling the dressing apparatus and the cleaning apparatus.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.