Method and apparatus for improved chemical mechanical planarization and CMP pad
US7846008B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 6, 2007 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | Jun 5, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad includes a guide plate, a porous slurry distribution layer and a flexible under-layer. Polishing elements are interdigitated with one another through the slurry distribution layer and the guide plate. The polishing elements may be affixed to the compressible under-layer and pass through corresponding holes in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but be translatable in a vertical direction with respect to the guide plate. Optionally, a membrane may be positioned between the guide plate and the slurry distribution layer. The polishing pad may also include wear sensors to assist in determinations of pad wear and end-of-life.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.