Methods and systems for removing protective films from microfeature workpieces
US7846288B2 · kind B2 · utility
6Cited by
5References
49Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2006 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | Sep 6, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1983
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods and systems for removing protective films from microfeature workpieces are disclosed herein. One particular embodiment of such a method comprises separating at least a portion of a protective tape from a workpiece to which the protective tape is attached with a separator configured to drive against an interface between the protective tape and the workpiece. The method further includes engaging the portion of the protective tape detached from the workpiece with a removal system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.