LED chip thermal management and fabrication methods
US7846751B2 · kind B2 · utility
20Cited by
10References
18Claims
0Family size
Inventor
Key dates
| Filing date | Nov 19, 2007 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | Apr 5, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8516
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a method of fabricating a high power light-emitting device using an electrolessly or electrolytically plated metal composite heat dissipation substrate having a high thermal conductivity and a thermal expansion coefficient matching with the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.