Manufacturing method for integrating a shunt resistor into a semiconductor package
US7847391B2 · kind B2 · utility
9Cited by
10References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2008 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | Jan 19, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.