Patent · US Active

High speed memory architecture

US7848153B2 · kind B2 · utility

8Cited by
2References
30Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 19, 2008
Grant dateDec 7, 2010
Priority date
Expiry dateFeb 21, 2029

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/15311
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

Memory devices and memory modules are disclosed. In one embodiment, a memory device includes a semiconductor substrate having a first edge and a second edge opposed to the first edge. A plurality of memory banks is disposed at a central portion of the semiconductor substrate, each memory bank including a plurality of memory cells. A plurality of input/output contacts is disposed between the first edge and the memory banks. Delay locked loop circuitry is disposed adjacent the first edge. A plurality of address and command contacts is disposed between the second edge and the memory banks.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.