Apparatus and method for manufacturing semiconductor device
US7849897B2 · kind B2 · utility
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1References
10Claims
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Assignee
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Key dates
| Filing date | Aug 24, 2007 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Jun 18, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/16
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for manufacturing a semiconductor device, includes: a collet; an alignment stage; and a sheet feeding mechanism. The collet is configured to suck a surface of a semiconductor chip. The surface is on opposite side of a bonding surface to be bonded to a bonding target. The bonding surface is provided with a film-like adhesive layer. The collet includes a heater for heating the adhesive layer. The alignment stage is configured to support the semiconductor chip and to correct position of the semiconductor chip. The sheet feeding mechanism is configured to feed a release sheet onto the alignment stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.