Junya Sagara
7Patents
4h-index
17Co-inventors
46Inventor score
Filing activity: Feb 1, 2006 → Mar 23, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7675153B2 | Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof | Electricity | 13 | Active |
| US7932162B2 | Method for manufacturing a stacked semiconductor package, and stacked semiconductor package | Electricity | 5 | Active |
| US7569921B2 | Semiconductor device and manufacturing method thereof | Electricity | 5 | Active |
| US7892890B2 | Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof | Electricity | 4 | Active |
| US8294282B2 | Semiconductor device and adhesive sheet | Electricity | 2 | Active |
| US8231046B2 | Wire bonding apparatus and wire bonding method | Electricity | 0 | Active |
| US7849897B2 | Apparatus and method for manufacturing semiconductor device | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.