Pump enclosure
US7850261B2 · kind B2 · utility
1Cited by
19References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 1, 2004 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Jan 9, 2027 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF04B53/08
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A pump enclosure includes a base, a plurality of pillars, and a cover. One of the pillars includes interconnecting aluminium extrusions defining therebetween a housing for pump control circuitry. This pillar can also provide a heat sink for dissipating heat generated during use of a pump away from the control circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.