Patent · US Active

Power semiconductor module method

US7851267B2 · kind B2 · utility

2Cited by

6References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Benedikt Specht · Lennestadt, DE
Gottfried Ferber · Warstein, DE

Key dates

Filing date	Oct 18, 2007
Grant date	Dec 14, 2010
Priority date	—
Expiry date	Jul 12, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for assembling a power module includes providing a casing with a plurality of receiving elements. At least one substrate carrying at least one semiconductor chip is provided within the casing. At least one support element is provided. An elastically stressed cover is arranged over the at least one support element, and the cover is released so that the elastically stressed cover is restrained by the at least one support element and the plurality of receiving elements.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.