Multi-chip assembly with optically coupled die
US7851809B2 · kind B2 · utility
1Cited by
10References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2009 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Jul 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.