Patent · US Active

Flexible circuit electronic package with standoffs

US7851906B2 · kind B2 · utility

12Cited by

22References

24Claims

0Family size

Assignee

Endicott Interconnect Technologies, Inc. · US

Inventors

David J. Alcoe · Vestal, US
Varaprasad V. Calmidi · Binghamton, US

Key dates

Filing date	Mar 26, 2007
Grant date	Dec 14, 2010
Priority date	—
Expiry date	Oct 31, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/09701
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A flexible circuit electronic package including a heat sink, a flexible circuit having a semiconductor chip positioned thereon and electrically coupled thereto, and a quantity of heat shrunk adhesive securing the flexible circuit to the heat sink such that the flexible circuit is planar. This package is then adapted for being positioned on and electrically coupled to a circuitized substrate such as a printed circuit board. A method of making this package is also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.