Curvature-based edge bump quantification
US7853429B2 · kind B2 · utility
7Cited by
10References
10Claims
0Family size
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Key dates
| Filing date | Apr 23, 2007 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Mar 30, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9501
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Evaluating irregularities in surfaces of objects such as semiconductor wafers using a thickness profile of a surface section and analyzing the profile to obtain information of an irregularity start position, magnitude, and span along with surface slope and height information.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.