Method of mounting conductive ball and conductive ball mounting apparatus
US7854366B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2008 |
| Grant date | Dec 21, 2010 |
| Priority date | — |
| Expiry date | Dec 30, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0557
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of mounting a conductive ball according to the present invention includes the steps of, disposing a mask on a substrate including connection pads, the mask having opening portions corresponding to the connection pad, supplying conductive balls on the mask, arranging the conductive balls on the connection pad of the substrate through the opening portions of the mask by moving the conductive balls to one end side of the mask by ball moving member (a brush), and removing excess conductive balls remaining on a region of the mask where the opening portions are provided, by bonding the excess conductive balls to a ball removal film (adhesive film).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.