Apparatus and method for arranging magnetic solder balls
US7854367B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2010 |
| Grant date | Dec 21, 2010 |
| Priority date | — |
| Expiry date | Jul 9, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/104
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower surface of the placed and fixed substrate so as to cause a magnetic force to act in an upward direction of the stage; and a mask frame capable of being positioned above the stage. An arranging method using this arranging apparatus is also provided. An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a mask frame capable of being positioned above the stage; and a magnetic generator which is movable above the mask frame and causes a magnetic force to act on the stage. An arranging method using this arranging apparatus is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.