Device having a contacting structure
US7855451B2 · kind B2 · utility
0Cited by
13References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2007 |
| Grant date | Dec 21, 2010 |
| Priority date | — |
| Expiry date | Jul 6, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.