Integrated process condition sensing wafer and data analysis system
US7855549B2 · kind B2 · utility
16Cited by
39References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2006 |
| Grant date | Dec 21, 2010 |
| Priority date | — |
| Expiry date | Mar 25, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition-measuring device to a user with little or no human intervention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.