Method of SIMD-ization through data reshaping, padding, and alignment
US7856627B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2006 |
| Grant date | Dec 21, 2010 |
| Priority date | — |
| Expiry date | Oct 21, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F8/443
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for handling Simple Instruction Multiple Data (SIMD) architecture restrictions through data reshaping, padding, and alignment, including: building a global call graph; creating array descriptors for maintaining array attributes; gathering array affinity information; performing global pointer analysis and escape analysis; performing loop-based analysis to identify a SIMD opportunity; building an array affinity graph; performing graph partitioning on the array affinity graph to construct an array reshaping plan; performing data reshaping on the array affinity graph; and performing SIMDization on the array affinity graph wherein SIMDization comprises automatic generation of SIMD code.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.