Process for depositing organic materials
US7858144B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2007 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Jun 5, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D2252/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process of making an organic thin film on a substrate by atomic layer deposition is disclosed, the process comprising simultaneously directing a series of gas flows along substantially parallel elongated channels, and wherein the series of gas flows comprises, in order, at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, optionally repeated a plurality of times, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material wherein the first reactive gaseous material, the second reactive gaseous material or both is a volatile organic compound. The process is carried out substantially at or above atmospheric pressure and at a temperature under 250° C., during deposition of the organic thin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.