MEMS coupler and method to form the same
US7858422B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2007 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Jul 10, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0271
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS coupler and a method to form a MEMS structure having such a coupler are described. In an embodiment, a MEMS structure comprises a member and a substrate. A coupler extends through a portion of the member and connects the member with the substrate. The member is comprised of a first material and the coupler is comprised of a second material. In one embodiment, the first and second materials are substantially the same. In one embodiment, the second material is conductive and is different than the first material. In another embodiment, a method for fabricating a MEMS structure comprises first forming a member above a substrate. A coupler comprised of a conductive material is then formed to connect the member with the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.