Electronic device and method of manufacturing thereof
US7858444B2 · kind B2 · utility
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0References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2009 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Feb 23, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The device has a carrier and an electric element. The carrier has a first and an opposed side and is provided with an connection layer, an intermediate layer and contact pads. The element is present at the first side and coupled to the connection layer. It is at least partially encapsulated by an encapsulation that extends into isolation areas between patterns in the intermediate layer. A protective layer is present at the second side of the carrier, which covers an interface between the contact pads and the intermediate layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.