Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films
US7858721B2 · kind B2 · utility
1Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2009 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Apr 27, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/038
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.