Solder resist material, wiring board using the solder resist material, and semiconductor package
US7859110B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2007 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Aug 8, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31525
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a solder resist material, which can suppress the warpage of a semiconductor package upon exposure to heat or impact even when used in a thin wiring board and meets a demand for size reduction in electronic devices and a higher level of integration, and a wiring board comprising the solder resist material and a semiconductor package. The solder resist material of the present invention can effectively suppress the warpage of a semiconductor package through a fiber base material-containing layer interposed between resin layers. The fiber base material-containing layer is preferably unevenly distributed in the thickness direction of the solder resist material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.