Kensuke Nakamura
26Patents
10h-index
54Co-inventors
78Inventor score
Filing activity: Feb 4, 1997 → Feb 28, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8227703B2 | Multilayered circuit board and semiconductor device | Electricity | 46 | Active |
| US5913742A | Tensioner for an endless transmitting member | Mechanical Engineering; Lighting; Heating | 38 | Expired |
| US6364796B1 | Blade chain tensioner | Mechanical Engineering; Lighting; Heating | 26 | Expired |
| US5743230A | Balancer shaft supporting structure in engine | Mechanical Engineering; Lighting; Heating | 19 | Expired |
| US5803854A | Silent chain having a sheared link bearing surface | Mechanical Engineering; Lighting; Heating | 15 | Expired |
| US9123830B2 | Manufacturing method for semiconductor device | Electricity | 12 | Active |
| US6483195B1 | Transfer bump street, semiconductor flip chip and method of producing same | Electricity | 12 | Expired |
| US6808467B2 | Blade tensioner and system for a chain | Mechanical Engineering; Lighting; Heating | 12 | Expired |
| US6332441A | Assembling arrangement for tensioner and hydraulic control valve | Mechanical Engineering; Lighting; Heating | 11 | Expired |
| US6620067B1 | Tensioner device | Mechanical Engineering; Lighting; Heating | 10 | Expired |
| US5788381A | Rotary shaft lubricating structure | Mechanical Engineering; Lighting; Heating | 9 | Expired |
| US6308679A | Separator structure of chain case | Mechanical Engineering; Lighting; Heating | 7 | Expired |
| US7331502B2 | Method of manufacturing electronic part and electronic part obtained by the method | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6768197B2 | Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device | Electricity | 4 | Expired |
| US9002609B2 | Vehicle brake control system | Performing Operations; Transporting | 4 | Active |
| US8592994B2 | Semiconductor package, core layer material, buildup layer material, and sealing resin composition | Electricity | 3 | Active |
| US8871660B2 | Laminated body, circuit board including laminated body, semiconductor package and process for manufacturing laminated body | Emerging Cross-Sectional Technologies | 2 | Active |
| US9349714B2 | Method of manufacturing semiconductor device, block stacked body, and sequential stacked body | Electricity | 2 | Active |
| US12219688B2 | Dielectric barrier plasma generator and plasma discharge starting method for dielectric barrier plasma generator | Electricity | 2 | Active |
| US8062539B2 | Method for manufacturing multilayer printed wiring board and multilayer printed wiring board obtained by the same | Emerging Cross-Sectional Technologies | 2 | Active |
| US8304091B2 | Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof | Emerging Cross-Sectional Technologies | 1 | Active |
| US8205329B2 | Method for manufacturing dielectric layer constituting material, dielectric layer constituting material obtained thereby; method for manufacturing capacitor circuit forming piece using dielectric layer constituting material, capacitor circuit forming piece obtained thereby; and multi-layer printed wiring board obtained by using dielectric layer constituting material and/or capacitor circuit forming piece | Emerging Cross-Sectional Technologies | 1 | Active |
| US12432841B2 | Dielectric barrier discharge plasma generator | Electricity | 0 | Active |
| US7859110B2 | Solder resist material, wiring board using the solder resist material, and semiconductor package | Emerging Cross-Sectional Technologies | 0 | Active |
| US9707847B2 | Braking control device and control method | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.