Final via structures for bond pad-solder ball interconnections
US7859122B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2008 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Jan 15, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure and a method for forming the same. The structure includes a first dielectric layer, an electrically conductive bond pad on the first dielectric layer, and a second dielectric layer on top of the first dielectric layer and the electrically conductive bond pad. The electrically conductive bond pad is sandwiched between the first and second dielectric layers. The second dielectric layer includes N separate final via openings such that a top surface of the electrically conductive bond pad is exposed to a surrounding ambient through each final via opening of the N separate final via openings. N is a positive integer greater than 1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.