Inventor · Burlington, VT, US

Christopher D. Muzzy

140Patents
12h-index
61Co-inventors
85Inventor score

Filing activity: Feb 20, 2002 → Jan 27, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US7323780B2 Electrical interconnection structure formation Electricity 59 Active
US7825511B2 Undercut-free BLM process for Pb-free and Pb-reduced C4 Electricity 31 Active
US8742594B2 Structure and method of making an offset-trench crackstop that forms an air gap adjacent to a passivated metal crackstop Electricity 28 Active
US7482675B2 Probing pads in kerf area for wafer testing Electricity 26 Expired
US7459785B2 Electrical interconnection structure formation Electricity 25 Active
US7348210B2 Post bump passivation for soft error protection Electricity 20 Expired
US7176583B2 Damascene patterning of barrier layer metal for C4 solder bumps Emerging Cross-Sectional Technologies 17 Expired
US8508043B2 Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump Electricity 16 Active
US8298930B2 Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof Electricity 15 Active
US8198133B2 Structures and methods to improve lead-free C4 interconnect reliability Electricity 14 Active
US7985671B2 Structures and methods for improving solder bump connections in semiconductor devices Electricity 14 Active
US6924210B1 Chip dicing Performing Operations; Transporting 13 Expired
US7541272B2 Damascene patterning of barrier layer metal for C4 solder bumps Emerging Cross-Sectional Technologies 12 Active
US7485564B2 Undercut-free BLM process for Pb-free and Pb-reduced C4 Electricity 12 Active
US7112470B2 Chip dicing Electricity 12 Expired
US8350383B2 IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methods Electricity 10 Active
US7635643B2 Method for forming C4 connections on integrated circuit chips and the resulting devices Electricity 10 Active
US7329951B2 Solder bumps in flip-chip technologies Electricity 10 Expired
US7859122B2 Final via structures for bond pad-solder ball interconnections Electricity 9 Active
US9679806B1 Nanowires for pillar interconnects Electricity 9 Active
US7316940B2 Chip dicing Electricity 8 Active
US8637392B2 Solder interconnect with non-wettable sidewall pillars and methods of manufacture Electricity 8 Active
US9799618B1 Mixed UBM and mixed pitch on a single die Electricity 8 Active
US7256503B2 Chip underfill in flip-chip technologies Electricity 7 Expired
US8476762B2 Ni plating of a BLM edge for Pb-free C4 undercut control Electricity 7 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.