Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7863187B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2005 |
| Grant date | Jan 4, 2011 |
| Priority date | — |
| Expiry date | May 25, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for forming interconnects in microfeature workpieces, and microfeature workpieces having such interconnects are disclosed herein. The microfeature workpieces may have a terminal and a substrate with a first side carrying the terminal and a second side opposite the first side. In one embodiment, a method includes (a) constructing an electrically conductive interconnect extending from the terminal to at least an intermediate depth in the substrate with the interconnect electrically connected to the terminal, and (b) removing material from the second side of the substrate so that a portion of the interconnect projects from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.