Implantation of multiple species to address copper reliability
US7863194B2 · kind B2 · utility
7Cited by
1References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 14, 2010 |
| Grant date | Jan 4, 2011 |
| Priority date | — |
| Expiry date | Apr 14, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76867
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first species and a second species are implanted into a conductor of a substrate, which may be copper. The first species and second species may be implanted sequentially or at least partly simultaneously. Diffusion of the first species within the conductor of the substrate is prevented by the presence of the second species. In one particular example, the first species is silicon and the second species is nitrogen, although other combinations are possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.