Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method
US7863542B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 25, 2006 |
| Grant date | Jan 4, 2011 |
| Priority date | — |
| Expiry date | Oct 5, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/1462
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing apparatus is provided. The laser processing apparatus is for performing pattern processing of a transparent conductive film that is formed on a multilayer film on a substrate by using laser light, includes debris extraction module having a vortex generation mechanism that generates a vortex flow by directing gas into the vicinity of a laser-irradiated portion of the transparent conductive film. The debris extraction module is disposed close to the substrate, and debris before deposition and after deposition on the substrate, which is generated by laser irradiation, is entrapped into the vortex flow to be extracted to the outside with the gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.