Semiconductor module including components in plastic casing

US7863728B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Gottfried Beer · Nittendorf, DE
• Christoph Kienmayer · Unterhaching, DE
• Klaus Pressel · Regensburg, DE
• Werner Simbuerger · Haar, DE

Key dates

• Filing date: Oct 9, 2007
• Grant date: Jan 4, 2011
• Expiry date: Oct 9, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor module includes components in a plastic casing. The semiconductor module includes a plastic package molding compound and a semiconductor chip. Also provided in the module are a first principal surface including an upper side of the plastic package molding compound and at least one active upper side of the semiconductor chip, a second principal surface including a back side of the plastic package molding compound, and a multilayered conductor track structure disposed on the first principal surface and a second metal layer disposed on the second principal surface.