Back end integrated WLCSP structure without aluminum pads
US7863742B2 · kind B2 · utility
66Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2007 |
| Grant date | Jan 4, 2011 |
| Priority date | — |
| Expiry date | Apr 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit structure includes a passivation layer; a via opening in the passivation layer; a copper-containing via in the via opening; a polymer layer over the passivation layer, wherein the polymer layer comprises an aperture, and wherein the copper-containing via is exposed through the aperture; a post-passivation interconnect (PPI) line over the polymer layer, wherein the PPI line extends into the aperture and physically contacts the copper-via opening; and an under-bump metallurgy (UBM) over and electrically connected to the PPI line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.