Daniel Yang
7Patents
1h-index
12Co-inventors
44Inventor score
Filing activity: Nov 1, 2007 → Apr 9, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7863742B2 | Back end integrated WLCSP structure without aluminum pads | Electricity | 66 | Active |
| US11756840B2 | Reflectance measurement system and method thereof | Physics | 1 | Active |
| US11827243B2 | Automated vehicle safety response methods and corresponding vehicle safety systems with serial-parallel computing architectures | Performing Operations; Transporting | 0 | Active |
| US10978331B2 | Systems and methods for orientator based wafer defect sensing | Electricity | 0 | Active |
| US11664260B2 | Systems and methods for orientator based wafer defect sensing | Electricity | 0 | Active |
| US11535101B2 | Intelligent user manual system for vehicles | Performing Operations; Transporting | 0 | Active |
| US11667302B2 | Automated vehicle safety response methods and corresponding vehicle safety systems with serialized computing architectures | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.