Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatus
US7866533B2 · kind B2 · utility
0Cited by
6References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 17, 2008 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | Jan 13, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0557
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a method of removing conductive balls that are left on a mask provided on a substrate having pads thereon, the method includes: (a) making a sheet member close to the mask using a contacting mechanism such that a gap between the sheet member and the mask is set small than a diameter of the conductive balls. The conductive balls are removed in such a manner that the conductive balls are adhered onto the sheet member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.