Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method
US7866534B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2008 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | Jul 10, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a conductive ball mounting apparatus. The conductive ball mounting apparatus includes: a conductive ball mounting mask disposed to oppose a substrate having a plurality of pads coated with an adhesive flux, the conductive ball mounting mask having a plurality of ball mounting through holes for mounting each of conductive balls on each of the plurality of pads, the plurality of ball mounting through holes being arranged to oppose to the plurality of pads; and a conductive ball supplying unit for moving or removing the conductive balls on the conductive ball mounting mask by sucking an air on an upper surface side of the conductive ball mounting mask. The conductive ball mounting mask includes through portions formed to block passing of the conductive balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.