Cerium oxide abrasive and method of polishing substrates
US7867303B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2006 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | Feb 16, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01P2006/12
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A cerium oxide abrasive slurry having, dispersed in a medium, cerium oxide particles whose primary particles have a median diameter of from 30 nm to 250 nm, a maximum particle diameter of 600 nm or smaller, and a specific surface area of from 7 to 45 m.2/g, and slurry particles have a median diameter of from 150 nm to 600 nm. The cerium oxide particles have structural parameter Y, representing an isotropic microstrain obtained by an X-ray Rietveld method (with RIETAN-94), of from 0.01 to 0.70, and structural parameter X, representing a primary particle diameter obtained by an X-ray Rietveld method (with RIETAN-94), of from 0.08 to 0.3. The cerium oxide abrasive slurry is made by a method of obtaining particles by firing at a temperature of from 600° C. to 900° C. and then pulverizing, then dispersing the resulting cerium oxide particles in a medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.