Patent · US Active

Semiconductor device

US7868430B2 · kind B2 · utility

2Cited by

3References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Stefan Paulus · Zeitlarn, DE
Manfred Fries · Hunderdorf, DE
Martin Petz · Hohenkammer, DE
Thomas Mueller · Lappersdorf, DE

Key dates

Filing date	Sep 26, 2008
Grant date	Jan 11, 2011
Priority date	—
Expiry date	Oct 30, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/14
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

This application relates to a semiconductor device comprising multiple separate leads molded in a molded structure, and a chip attached to the molded structure over at least two of the multiple separate leads.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.