Detecting open ground connections in surface mount connectors
US7868608B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2009 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | Jul 4, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/341
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device may include a current source for connecting to a printed circuit board. The device may also include a first FET switch pack and a second FET switch pack for connecting to the surface mount connector of the printed circuit board. Additionally, the device may include a FET controller connected to the first FET switch pack and the second FET switch pack. The FET controller may be utilized for connecting a first FET and a second FET to the first region of the surface mount connector. The FET controller may be configured for supplying the current to the first region of the surface mount connector to produce at least one continuous heat signature characteristic of an improperly connected ground pin. A thermal monitoring module may be used to identify the improper physical connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.