Sungjun Chun
37Patents
6h-index
40Co-inventors
69Inventor score
Filing activity: Oct 31, 2002 → Oct 24, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6789241B2 | Methodology for determining the placement of decoupling capacitors in a power distribution system | Physics | 39 | Expired |
| US9357649B2 | 276-pin buffered memory card with enhanced memory system interconnect | Electricity | 13 | Active |
| US7646082B2 | Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density | Electricity | 12 | Active |
| US7348667B2 | System and method for noise reduction in multi-layer ceramic packages | Electricity | 12 | Expired |
| US8624297B2 | Multi-layer circuit substrate fabrication and design methods providing improved transmission line integrity and increased routing density | Electricity | 7 | Active |
| US8288657B2 | Noise coupling reduction and impedance discontinuity control in high-speed ceramic modules | Emerging Cross-Sectional Technologies | 6 | Active |
| US10135162B1 | Method for fabricating a hybrid land grid array connector | Emerging Cross-Sectional Technologies | 5 | Active |
| US10128593B1 | Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body | Emerging Cross-Sectional Technologies | 4 | Active |
| US8927879B2 | Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures | Emerging Cross-Sectional Technologies | 4 | Active |
| US8645889B2 | Noise coupling reduction and impedance discontinuity control in high-speed ceramic modules | Emerging Cross-Sectional Technologies | 3 | Active |
| US10216884B2 | Signal via positioning in a multi-layer circuit board using a genetic via placement solver | Emerging Cross-Sectional Technologies | 2 | Active |
| US9881115B2 | Signal via positioning in a multi-layer circuit board using a genetic via placement solver | Emerging Cross-Sectional Technologies | 1 | Active |
| US11658378B2 | Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB) | Electricity | 1 | Active |
| US9955567B2 | Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures | Emerging Cross-Sectional Technologies | 1 | Active |
| US10223490B2 | Signal via positioning in a multi-layer circuit board using a genetic via placement solver | Emerging Cross-Sectional Technologies | 1 | Active |
| US7313747B2 | Measuring microprocessor susceptibility to internal noise generation | Physics | 1 | Active |
| US9875331B2 | Signal via positioning in a multi-layer circuit board using a genetic via placement solver | Emerging Cross-Sectional Technologies | 1 | Active |
| US9940426B2 | Signal via positioning in a multi-layer circuit board | Physics | 1 | Active |
| US8813000B2 | System for designing substrates having reference plane voids with strip segments | Emerging Cross-Sectional Technologies | 1 | Active |
| US9916410B2 | Signal via positioning in a multi-layer circuit board | Physics | 1 | Active |
| US8962475B2 | Multi-layer circuit substrate fabrication method providing improved transmission line integrity and increased routing density | Electricity | 1 | Active |
| US7821796B2 | Reference plane voids with strip segment for improving transmission line integrity over vias | Emerging Cross-Sectional Technologies | 1 | Active |
| US7868608B2 | Detecting open ground connections in surface mount connectors | Electricity | 0 | Active |
| US8407644B2 | Reducing crosstalk in the design of module nets | Electricity | 0 | Active |
| US7945881B2 | Method of reducing crosstalk induced noise in circuitry designs | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.