Heat dissipation device of notebook computer
US7869213B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2009 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | May 26, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device is provided for dissipating heat from a heat source inside a notebook computer, and includes a hood, a bottom board, a thermal insulation layer, and at least one fan. The hood and the bottom board together define a heat dissipation channel. The bottom board integrally forms a plurality of fins and pegs. The bottom board is set above the heat source. The fan is set above the bottom board to efficiently expel heat from the inside to the outside. With the plurality of fins and pegs, the heat dissipation surface area of the bottom board and the heat source is increased and the overall heat dissipation performance is enhanced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.