Methods of and apparatus for inspecting substrate
US7869644B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2005 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | Mar 23, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Inspection apparatus are used to inspect a substrate as solder is printed, components are mounted and the substrate is heated for a soldering process. Images of the substrate are taken both before and after a production process such as the component mounting process and the soldering process and their differences are extracted. Each component on the substrate may be identified by differentiation and binarization processes and setting conditions for windows are determined corresponding to identified components. Windows are set according to determined setting conditions for inspecting the conditions of the substrate by using image data in the set windows and standard inspection data corresponding to component identification data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.