Substrate support lift mechanism
US7871470B2 · kind B2 · utility
12Cited by
113References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2006 |
| Grant date | Jan 18, 2011 |
| Priority date | — |
| Expiry date | Nov 8, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for positioning a substrate support within a processing chamber is provided. In one embodiment, an apparatus for positioning a substrate support includes a yoke comprising a curved surface with a first slot formed therethrough, a base comprising a first surface adapted to support the substrate support and a curved second surface, wherein the curved second surface mates with the curved surface of the yoke and a first slot is formed through the curved second surface of the base, and a first threaded member disposed through the first slot in the yoke and the first slot in the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.