Patent · US Expired

Integrated coolant circuit arrangement, operating method and production method

US7872349B2 · kind B2 · utility

2Cited by

12References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Volker Lehmann · Hersbruck, DE
Reinhard Stengl · Stadtbergen, DE
Herbert Schaefer · Herdorf, DE

Key dates

Filing date	Jan 3, 2006
Grant date	Jan 18, 2011
Priority date	—
Expiry date	May 1, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/09701
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit arrangement and method of fabricating the integrated circuit arrangement is provided. At least one integrated electronic component is arranged at a main area of a substrate. The component is arranged in the substrate or is isolated from the substrate by an electrically insulating region. Main channels are formed in the substrate and arranged along the main area. Each main channel is completely surrounded by the substrate transversely with respect to a longitudinal axis. Transverse channels are arranged transversely with respect to the main channels. Each transverse channel opens into at least one main channel. More than about ten transverse channels open into a main channel.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.