Method for manufacturing probe structure of probe card
US7875193B2 · kind B2 · utility
0Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2007 |
| Grant date | Jan 25, 2011 |
| Priority date | — |
| Expiry date | Jun 25, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06727
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for manufacturing a probe structure of a probe card is disclosed. In accordance with the present invention, a portion of a substrate exposed through a crossing region of one more probe beam regions defined by a first mask layer pattern and a windows defined by a second mask layer pattern are etched to form one or more self-aligning probe tip regions, thereby preventing a misalignment of the one or more probe tip regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.