Method of fabricating polishing pad having detection window thereon
US7875335B2 · kind B2 · utility
0Cited by
9References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2006 |
| Grant date | Jan 25, 2011 |
| Priority date | — |
| Expiry date | May 30, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a polishing pad. The polishing pad comprises a transparent part and a high molecular weight layer. The transparent part has an uneven side surface and the profile of the uneven side surface is selected from a group consisting of a serrated shape, a wavy shape and a toothed shape. The high molecular weight layer encircles the transparent part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.