Method for a multiple exposure, microlithography projection exposure installation and a projection system
US7875418B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 19, 2008 |
| Grant date | Jan 25, 2011 |
| Priority date | — |
| Expiry date | Jul 22, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70991
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In a method for multiply exposing at least one substrate coated with a photosensitive layer, a first exposure is carried out in accordance with a first set of exposure parameters on a first projection system, and a second exposure is carried out in accordance with a second set of exposure parameters on a second projection system spatially separated from the first projection system. The projection systems are integrated in a common projection exposure installation. The first exposure can be carried out, for example, with an amplitude mask, the second exposure with a phase mask. The use of a number of projection systems enables multiple exposure that is performed in parallel and is therefore timesaving.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.