Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support
US7875500B2 · kind B2 · utility
21Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2008 |
| Grant date | Jan 25, 2011 |
| Priority date | — |
| Expiry date | Jul 17, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.