Device and method for on-die temperature measurement
US7878016B2 · kind B2 · utility
13Cited by
15References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2004 |
| Grant date | Feb 1, 2011 |
| Priority date | — |
| Expiry date | Feb 6, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F11/3058
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system for measuring and managing thermal operations of a processor core on a semiconductor die using a sensor positioned in a hotspot of the processor core. A measured temperature reading is determined based upon a temperature sensed by the sensor. Interrupt signals and a software readable register indicating temperature information provide feedback about the thermal environment to the processor. Based upon the measured temperature reading, the interrupt signals direct the processor to modify operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.